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PMEG3005EB; PMEG3005EL
0.5 A very low VF MEGA Schottky barrier rectifiers
Rev. 01 -- 29 November 2006 Product data sheet
1. Product profile
1.1 General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an integrated guard ring for stress protection, encapsulated in ultra small Surface-Mounted Device (SMD) plastic packages.
Table 1. Product overview Package NXP PMEG3005EB PMEG3005EL SOD523 SOD882 JEITA SC-79 single single Configuration
Type number
1.2 Features
I I I I Forward current: IF 0.5 A Reverse voltage: VR 30 V Very low forward voltage Ultra small SMD plastic packages
1.3 Applications
I I I I I
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Low voltage rectification High efficiency DC-to-DC conversion Switch mode power supply Reverse polarity protection Low power consumption applications
1.4 Quick reference data
Table 2. Symbol IF VR VF
[1]
Quick reference data Parameter forward current reverse voltage forward voltage IF = 500 mA
[1]
Conditions Tsp 55 C
Min -
Typ 430
Max 0.5 30 500
Unit A V mV
Pulse test: tp 300 s; 0.02.
NXP Semiconductors
PMEG3005EB; PMEG3005EL
0.5 A very low VF MEGA Schottky barrier rectifiers
2. Pinning information
Table 3. Pin SOD523 1 2 cathode anode
[1]
Pinning Description Simplified outline Symbol
1 1 2
2
sym001
SOD882 1 2 cathode anode
[1]
1 1 2
2
sym001
Transparent top view
[1]
The marking bar indicates the cathode.
3. Ordering information
Table 4. Ordering information Package Name PMEG3005EB PMEG3005EL SC-79 Description plastic surface-mounted package; 2 leads leadless ultra small plastic package; 2 terminals; body 1.0 x 0.6 x 0.5 mm Version SOD523 SOD882 Type number
4. Marking
Table 5. Marking codes Marking code KB AM Type number
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PMEG3005EB PMEG3005EL
PMEG3005EB_PMEG3005EL_1
(c) NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 29 November 2006
2 of 10
NXP Semiconductors
PMEG3005EB; PMEG3005EL
0.5 A very low VF MEGA Schottky barrier rectifiers
5. Limiting values
Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VR IF IFRM IFSM Ptot Parameter reverse voltage forward current repetitive peak forward current non-repetitive peak forward current total power dissipation PMEG3005EB PMEG3005EL Tj Tamb Tstg
[1]
Conditions Tsp 55 C tp 1 ms; 0.25 square wave; tp = 8 ms Tamb 25 C
[1]
Min -
Max 30 0.5 1 3
Unit V A A A
-65 -65
310 250 150 +150 +150
mW mW C C C
junction temperature ambient temperature storage temperature
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
6. Thermal characteristics
Table 7. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient PMEG3005EB PMEG3005EL Rth(j-sp) thermal resistance from junction to solder point PMEG3005EB
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Conditions in free air
[1][2]
Min
Typ
Max
Unit
[3]
-
400 500
K/W K/W
-
-
75
K/W
[1] [2] [3]
For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses PR are a significant part of the total power losses. Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Soldering point of cathode tab.
PMEG3005EB_PMEG3005EL_1
(c) NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 29 November 2006
3 of 10
NXP Semiconductors
PMEG3005EB; PMEG3005EL
0.5 A very low VF MEGA Schottky barrier rectifiers
7. Characteristics
Table 8. Characteristics Tamb = 25 C unless otherwise specified. Symbol VF Parameter forward voltage IF = 0.1 mA IF = 1 mA IF = 10 mA IF = 100 mA IF = 500 mA IR Cd
[1]
Conditions
[1]
Min -
Typ 90 150 210 295 430 15 70 24
Max 180 200 270 360 500 200 500 30
Unit mV mV mV mV mV A A pF
reverse current diode capacitance
Pulse test: tp 300 s; 0.02.
VR = 10 V VR = 30 V VR = 1 V; f = 1 MHz
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PMEG3005EB_PMEG3005EL_1
(c) NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 29 November 2006
4 of 10
NXP Semiconductors
PMEG3005EB; PMEG3005EL
0.5 A very low VF MEGA Schottky barrier rectifiers
104 IF (mA) 103
006aaa855
IR (A)
105
(1)
006aaa856
104 103 102
(2) (3)
102
(4)
10 10
(1) (2) (3) (4) (5)
1 10-1 10-2 10-3
(5)
1
10-1 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 VF (V)
0
5
10
15
20
25 30 VR (V)
(1) Tamb = 150 C (2) Tamb = 125 C (3) Tamb = 85 C (4) Tamb = 25 C (5) Tamb = -40 C
(1) Tamb = 150 C (2) Tamb = 125 C (3) Tamb = 85 C (4) Tamb = 25 C (5) Tamb = -40 C
Fig 1. Forward current as a function of forward voltage; typical values
40 Cd (pF) 30
Fig 2. Reverse current as a function of reverse voltage; typical values
006aaa857
20
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10
0 0 10 20 VR (V) 30
f = 1 MHz; Tamb = 25 C
Fig 3. Diode capacitance as a function of reverse voltage; typical values
PMEG3005EB_PMEG3005EL_1
(c) NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 29 November 2006
5 of 10
NXP Semiconductors
PMEG3005EB; PMEG3005EL
0.5 A very low VF MEGA Schottky barrier rectifiers
8. Test information
t1 t2
P t2 t1
duty cycle =
t
006aaa812
Fig 4. Duty cycle definition
9. Package outline
0.85 0.75 1 0.30 0.22 1.65 1.25 1.55 1.15 0.30 0.22 2 0.34 0.26 Dimensions in mm 0.17 0.11 02-12-13 0.55 0.47 Dimensions in mm cathode marking on top side 03-04-17 0.65 0.58
0.62 0.55 2
0.50 0.46
0.65
1.02 0.95
1
Fig 5. Package outline SOD523 (SC-79)
Fig 6. Package outline SOD882
10. Packing information
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Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number PMEG3005EB PMEG3005EL
[1]
Package SOD523 SOD882
Description 2 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel 2 mm pitch, 8 mm tape and reel
Packing quantity 3000 -115 8000 -315 10000 -135 -315
For further information and the availability of packing methods, see Section 14.
PMEG3005EB_PMEG3005EL_1
(c) NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 29 November 2006
6 of 10
NXP Semiconductors
PMEG3005EB; PMEG3005EL
0.5 A very low VF MEGA Schottky barrier rectifiers
11. Soldering
2.15
1.20
0.50 0.60
solder lands solder paste solder resist occupied area
1.80 1.90 0.30 0.40
mgs343
Reflow soldering is the only recommended soldering method. Dimensions in mm
Fig 7. Reflow soldering footprint SOD523 (SC-79)
1.30 R = 0.05 (8x) 0.30 R = 0.05 (8x)
0.90
0.60 0.70 0.80 (2x) (2x) (2x)
solder lands solder paste solder resist occupied area
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0.30 (2x) 0.40 (2x) 0.50 (2x)
mbl872
Reflow soldering is the only recommended soldering method. Dimensions in mm
Fig 8. Reflow soldering footprint SOD882
PMEG3005EB_PMEG3005EL_1
(c) NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 29 November 2006
7 of 10
NXP Semiconductors
PMEG3005EB; PMEG3005EL
0.5 A very low VF MEGA Schottky barrier rectifiers
12. Revision history
Table 10. Revision history Release date Data sheet status Product data sheet Change notice Supersedes Document ID
PMEG3005EB_PMEG3005EL_1 20061129
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PMEG3005EB_PMEG3005EL_1
(c) NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 29 November 2006
8 of 10
NXP Semiconductors
PMEG3005EB; PMEG3005EL
0.5 A very low VF MEGA Schottky barrier rectifiers
13. Legal information
13.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
13.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior www..net to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
14. Contact information
For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com
PMEG3005EB_PMEG3005EL_1
(c) NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 29 November 2006
9 of 10
NXP Semiconductors
PMEG3005EB; PMEG3005EL
0.5 A very low VF MEGA Schottky barrier rectifiers
15. Contents
1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 Packing information. . . . . . . . . . . . . . . . . . . . . . 6 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Contact information. . . . . . . . . . . . . . . . . . . . . . 9 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
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Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2006.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 29 November 2006 Document identifier: PMEG3005EB_PMEG3005EL_1

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